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      2. No Items SPEC
        1 Trace Width/Space 35μm /35μm
        2 Trace Width Tolerance ±10%
        3 Distance between Pad and Conductor 0.075mm
        4 Distance between Board Edge and Conductor 0.15mm
        5 Min. Pad Size 0.3*0.3mm
        6 PTH Pad Size 0.25mm
        7 Min. PTH Aperture 0.05mm
        8 Registration of Silk-Screen ±0.075mm
        9 Tolerance of External Dimension ±0.05mm
        10 Tolerance of Aperture ±0.015mm
        11 Registration of Hole ±0.025mm
        12 Thickness of Ni Plating 1μm-5μm
        13 Thickness of Au Plating 0.05μm-0.2μm 
        14 Maximum Layer 8 Layers



        項目 量產能力
        Chip器件 可加工最小尺寸電阻、電容電感 0201
        SMT加工直通率 99.95%
        連接器 可加工最小Pitch 連接器 0.4mm
        SMT加工直通率 99.80%
        BGA 可加工最小Pitch BGA器件 0.4mm
        SMT加工直通率 99.80%
        QFN 可加工最小Pitch QFN器件 0.4mm
        SMT加工直通率 99.80%
        LED LED燈貼裝角度精度 ±1°
        SMT加工直通率 99.90%
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